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Heat dissipating structural substrates

The right solution for every requirement

Efficient, durable, and versatile

Heat-dissipative structural ceramic substrates are an essential component of many production processes and equipment, including manufacturing heating elements and heat exchangers. To ensure high efficiency and long life, they must withstand various stresses, including high temperatures and chemical corrosion. This is where Kyocera's heat-dissipating structural ceramic substrates come into play.

Efficiency and energy saving

Our heat-dissipating structural ceramic substrates made from alumina and silicon carbide offer an efficient and energy-saving alternative to metal. The lightweight ceramic material with low heat capacity is ideal for cooling or heat exchange.

Design possibilities

With design options for thin-walled or complex structures, our heat-dissipating structural ceramic substrates can be customised to meet our customers' individual needs and requirements.

Long-term efficient cooling and temperature control

Our heat-dissipating structural ceramic substrates provide long-term efficient cooling and temperature control, resulting in lower maintenance costs due to excellent chemical resistance.


Using our heat-dissipative structural ceramic substrates allows our customers to explore new applications beyond cooling or temperature control. They can be used in a variety of applications, such as radiators for heating elements, temperature control components, heat exchanger components or manifolds.

Kyocera's heat-dissipating structural ceramic substrates offer a high-quality, durable, and versatile solution for your production processes. We will work with you to find the right material for your applications. Contact us today to find out more!

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