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Lamination technology – a different approach to additive manufacturing

Kyocera has developed a unique technical solution for producing complex inner structures in ceramic bodies.

Using a special bonding method several layers of substrates are stacked on each other and form a homogenous ceramic body. The mechanical, thermal and electrical properties of the material are no different from conventionally produced ceramic parts.

Processs flow

 

By this (simplified) process flow Kyocera can manufacture complex inner structures, channels and cavities as well as adding intermediate conductive layers for e.g. heating or measurement purposes.

Standard layer thickness and max. size are determined by the material. Several advanced ceramic materials are available for lamination:

Material

 

Max size (mm)

L x B x Total thickness

Tape thickness (mm)

 

AO479T700 x 700 x 300.6 ~ 1.2
AO479S700 x 700 x 401.0
AO579A700 x 700 x 400.5 ~ 1.0
SC140A670 x 700 x 300.75 ~ 0.85
CO221O670 x 700 x 201.0

Other materials and dimensions are available upon request.

Typical applications are e.g. handling arms, heat exchanger or trays.

 

Material characteristics
 

  UnitAO476TAO479TSC140A
Colour -WhiteWhiteBlack
Content wt%9699.6-
Bulk Density 3.73.93.1
Mechanical CharacteristicsVickers HardnessGPa13.916.323
Flexural Strength (3-point Bending)MPa380470450 (4-point Bending)
Young's Modulus of ElasticityGPa340380430
Poisson's Ratio-0.230.230.17
Thermal CharacteristicsThermal ConductivityW/(m-K)2630180
Specific Heat CapacityJ/(g-K)0.780.790.67

Coefficient of Linear Thermal Expansion

(40-400°C)

ppm/K77.63.7
Electrical CharacteristicsDielectric StrengthkV/mm1518-
Volume ResistivityRTΩ*cm>1014>1014-
300°CΩ*cm1.0 x 10104.9 x 1010-
500°CΩ*cm1.1 x 1083.5 x 108-
Dielectric Loss Tangent 1MHz3.0 x 10-41.0 x 10-4-
Dielectric Constant 1MHz9.610.2-

FOR MORE INFORMATION 

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